HORIZON-JU-Chips-2023-RIA-CPL-3: Pilot line on advanced Packaging and Heterogenous Integration

Planned opening date 01 February 2024 Type of action HORIZON-RIA HORIZON Research and Innovation Actions The pilot line shall provide a platform for chiplet integration. • This platform shall enable 2.5D and 3D heterogeneous integration for multiple core technologies (CMOS, Opto/RF) and devices (MEMS, Opto). It should enable chiplet integration of advanced nodes from external sources. As an important technology basis, fan-out and fan-in wafer level packaging should be developed for the different integration concepts. In the same way, through-x via and interposer technologies should be developed [...]